Forbes contributors publish independent expert analyses and insights. Dave Altavilla is a Tech Analyst covering chips, compute and AI. In a joint announcement reflecting the growing importance of ...

AI-driven design solution enables circuit optimization, saving weeks of manual and iterative effort while increasing design quality. Interoperable process design kits for all advanced TSMC FinFET ...

HAIFA, Israel--(BUSINESS WIRE)--proteanTecs®, a global leader in advanced analytics for semiconductor health and performance monitoring, today announced the successful silicon-proven validation of its ...

Multi-generational agreement advances Intel’s IDM 2.0 strategy. Partnership broadens and accelerates IP access for Intel foundry ecosystem. Agreement builds on longstanding IP and EDA strategic ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that its digital full flow and custom/analog tool suites have been further enhanced to deliver optimal ...

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...

Intel is trying to catch up with TSMC in terms of process technologies and advanced global production capacity, but when it comes to the U.S., the chip giant remains unrivalled. Intel's Fab 52 is more ...

From the Consumer Electronics Show (CES) 2025 at the beginning of the year, Nvidia's GPU Technology Conference (GTC) in March, to TSMC's North America Technology Symposium in April, and the upcoming ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

Intel Corp. has shared new information about Intel 14A, an upcoming chip manufacturing process that will use ASML Holding NV’s most advanced lithography machines. Executives detailed the process today ...