As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking chips on top of each other. This vertically layered architecture could allow ...
AI agents capable of handling large portions of chip design and verification are less about convenience and more about maintaining a competitive edge globally.
This is the world’s first AI-powered super agent from Cadence that autonomously creates and verifies designs from specifications and high-level descriptions ...
HRL will present initial data from the project at the GOMACtech conference next week in Pasadena, Calif. HRL is directing the overall program, leading the system design, developing thermal isolation ...
Qorvo® and ubisys have developed a new ultra-compatible gateway solution. It allows various devices to communicate by integrating a ZigBee® 3.0 and Green Power-based smart home network within the Open ...
Cadence today announced a transformative step forward in redefining how semiconductors are designed with the launch of the ChipStack™ AI Super Agent.
Some results have been hidden because they may be inaccessible to you
Show inaccessible results