In advanced semiconductor manufacturing, inspection and FA are not overhead—they are economic control mechanisms that protect ...

Not all defects are visible with the same microscope. Explore how resolution, contrast, and signal interpretation shape semiconductor failure investigations.

When contamination defects surface in advanced nodes, the root cause often spans tools, materials, and handling. This piece outlines how defect mapping, TEM, and SPC data converge to prove causation.

Decapsulation of plastic IC packages in different types and size were performed by wet chemical technique. Studied devices were to use in satellites and going to subject a series of test which require ...

If you’ve ever had to create a Failure Modes, Effects and Diagnostic Analysis (FMEDA), you know how difficult and painstaking a task it can be. But FMEDAs are essential in ensuring that your SoCs ...

Two expectations informed end-users have of electric motor service centers are reliable best practice repairs and root cause failure analysis (RCFA) to prevent recurring failures. Service centers ...

The first step for semiconductor chips is visual inspection using an optical microscope or electrical measurements. 2 Mechanical probing, electron beams, emission microscopy, liquid crystal, etc., are ...

Each phase of a project has unique failure signature patterns. Just like the bathtub curve in Figure 2, we see more “failures” in the initial design, development and early production “ramp up” phase.