Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor applications, and renewable energy solutions such as wind and solar power.
Texas Instruments revealed a family of isolated power modules based on its IsoShield multichip packaging technology, claiming 3X higher power density than discrete solutions in isolated power designs.
Nexperia and Semikron Danfoss have signed an MoU to explore a strategic collaboration on SiC-based power modules for automotive traction inverter applications. The collaboration aims to combine ...
Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...
In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...
Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...
Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking heritage, the company offers ...
The adoption of N-type modules around the world continues apace, with technologies including TOPCon, HJT and BC rapidly taking a dominant position due to the multiple and significant advantages of ...
V to AI-driven manufacturing and startup-led innovation, Sharat Kaul of the International Electronics Manufacturing ...
As AI data centres continue to scale, token generation is limited by power availability, while efficiency is a defining factor for return on investment. Traditional architectures based on bulky, ...
How can power modules be manufactured to reliably function under increasing power densities, higher temperatures and new ...
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