Revamping an existing plant to increase production with minimum investment is important in today's process industries. Revamping a process plant is more complex than building a new plant. Revamps ...

A novel parallel computing framework for chemical process simulation has been proposed by researchers from the East China University of Science and Technology and the University of Sheffield. This ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

Stockholm Exergi is Stockholm’s energy company, operating the region’s district heating and cooling network and supplying ...

Novel semiconductor technologies are creating complex process flows, which are needed to support the manufacturing of advanced 3D semiconductor structures. It can be helpful to model process flows, ...

Siemens announced a new Additive Manufacturing (AM) Process Simulation solution for predicting distortion during 3D printing. The product is fully integrated into Siemens’ end-to-end Additive ...