Heatsink technology has rapidly improved over the last few years. The introduction of heatpipes, use of large radius fans and the sophisticated mounting mechanisms have all aided these developments.

This whitepaper discusses the advantages of transient thermal test methods for IC package and thermal interface material (TIM) thermal characterization testing vs steady state methods. These methods ...

Engineers have long used thermal-cycle testing determine the reliability of PWBs (printed wire boards). Traditionally, engineers have used thermal-cycling ovens, liquid to liquid and fluidized sand, ...

Hyundai-Kia America Technical Center (HATCI) and Forward Engineering North America LLC recently worked together to design a new method of testing thermal runaway performance in composite materials for ...

WILSONVILLE, Ore.--(BUSINESS WIRE)--Mentor Graphics Corporation (NASDAQ:MENT) today announced that JEDEC, the organization dedicated to open standards in the microelectronics industry, has approved a ...

As the transistor density and switching speed of integrated circuits (ICs) increase and the package size decreases, the emerging generation of high-power ICs requires thermal management during testing ...

Researchers at the US Department of Energy’s Argonne National Laboratory have unveiled a breakthrough ...

Due to their light weight and optimal mechanical properties, modern composite materials, such as carbon fiber-reinforced polymers (CFRP), are increasingly used in automotive, wind energy and ...

Mentor Graphics announced that JEDEC has approved a thermaltransient testing-based measurement methodology inspired by an original ideapublished jointly by the Mentor Graphics MicReD group and the ...