TDK Corporation presents a new series of highly integrated, multi-channel power management modules for smartphones and tablets. TDK Corporation presents a new series of highly integrated, ...
New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.
Since GSM modems have been equipped with a GPS receiver and a micro-controller, they offer unlimited application opportunities with lower procurement costs and shorter development times. Navigation, ...
At embedded world 2026 on the DigiKey booth, Lucy Barnard spoke with Ravindra Singh, Product Manager for Radio Modules and Ninad Mehta, Product Manager for MEMS Sensors at Würth Elektronik ...
The RN171 is a small form factor, ultra-low power embedded TCP/IP module measuring only 27 x 18 x 3.1 mm. The RN171 is a full-featured 802.11 b/g surface mount module. Due to its small form factor and ...
Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN DIEGO, CA, UNITED STATES, January 9, 2026 ...
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