With wearable Internet of Things devices, such as smartwatches, contact with skin adds a new layer of complexity. .
Abstract: The floorplan of chiplets in heterogeneously integrated systems-in-package (SiPs) must consider multiphysics (electrical, thermal, and mechanical) performance and meet positional constraints ...
Abstract: This work reports on the development of a micromachined monolithic single-axis electromagnetic accelerometer based on the relative motion between the windings of a concentric planar ...
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