A team at the University of California, San Diego has redesigned how RRAM operates in an effort to accelerate the execution ...
As the global AI computing race intensifies, the primary constraint is shifting from GPU architecture to memory physics. HBM ...
Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...
Designed to take on high-bandwidth memory in data centers, Z-Angle memory (ZAM) leverages diagonal interconnects for improved thermal conductivity.
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