High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends
Abstract: The applications of wide bandgap (WBG) semiconductors represented by silicon carbide (SiC) and gallium nitride (GaN) in power modules are currently limited by the thermal stability of ...
Abstract: A new concept for encapsulation of discrete bipolar high-power devices using epoxy mold compound (EMC) is demonstrated on silicon 4.5-kV press-pack fast recovery diodes (FRDs) with wafer ...
Copyright (C) 1999-2023 by Shigeru Chiba, All rights reserved. Javassist (JAVA programming ASSISTant) makes Java bytecode manipulation simple. It is a class library ...
The Facebook Business SDK is a one-stop shop to help our partners better serve their businesses. Partners are using multiple Facebook API's to serve the needs of their clients. Adopting all these ...
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