Tech Xplore on MSN

AI memory bottleneck may ease as ultrathin chip stacks quadruple high-bandwidth memory density

A Korean research team has developed a technology that enables the stable stacking of more than 10 ultrathin semiconductor ...
IEEE Spectrum on MSN

Stacking chips sideways gives AI more memory

Solving a tricky 3D integration problem could boost bandwidth and keep chips cooler ...

Samsung is building a dedicated AI chip for PCs, and HP and Lenovo are already testing it

According to multiple Korean outlets, including Chosun, Samsung's LSI division which works on the Exynos mobile chips, is ...
Electronic Design

AMD Moves from HBM to LPDDR5X with New Memory-on-Package SoC

The company is replacing hard-to-find high bandwidth memory (HBM) with LPDDR5X in its latest Versal processor.
Tom's Hardware on MSN

Researchers turn HBM on its side to tackle AI memory’s heat wall

Researchers in Korea and Japan have proposed sideways-stacked DRAM designs that could push future AI memory beyond ...