Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...
A technical paper titled “Improved Defect Detection and Classification Method for Advanced IC Nodes by Using Slicing Aided Hyper Inference with Refinement Strategy” was published by researchers at ...
This study is led by Prof. Shuangyin Wang (College of Chemistry and Chemical Engineering, Hunan University) and Prof. Chen Chen (College of Chemistry and Chemical Engineering, Hunan University).
In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced packaging challenges.
Hidden semiconductor defects often pass inspection but fail later in operation. Learn how latent defects form, evade ...
(Nanowerk Spotlight) Scientists have sought to leverage atomic defects to enhance electrocatalytic performance for clean energy applications. However, the inability to precisely study defects' ...
An international research team led by NYU Tandon School of Engineering and KAIST (Korea Advanced Institute of Science and Technology) has pioneered a new technique to identify and characterize ...
Scientists have found a promising new way to manufacture one of industry’s toughest materials—tungsten carbide–cobalt—using advanced 3D printing. Normally, producing this ultra-hard material requires ...
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Korean researchers unmask two key defects that hold back silicon solar cell efficiency
Korean researchers have found that the defects limiting silicon heterojunction solar cells (SHJ), the ...
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