Abstract: The conventional packaging technique, especially the aluminum bond wire, limits the high-temperature resistance of SiC-based power devices. This study adopts the DSC (Double-sided Cooling) ...
Abstract: This paper presents a novel digital twin for power modules in electric vehicles (EVs), utilizing physics-informed Artificial Intelligence (AI) to predict thermomechanical stresses.
Arduino has just announced the Arduino Matter Discovery Bundle (AKX00081), an all-in-one development kit designed to help ...
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